Thermal Conductive Pad

GTP-025LD Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features and Benefits:Thermal conductivity 2.5 W/m-K ;Low Density;Very soft & high compressibility;Natural tacky ;Good Electrically isolating ;Excellent resiliency, tensile strength, and abrasion resistance

Applications:Computer services: CPU, Heat sink;Memory modules ;New energy automobile;Military Electronics;Telecom services;Wireless instruments;Telecom services;Wireless instruments;Automotive control services

Please contact us for other special requirements such as:

With or without adhesive

Custom die-cut shapes

Special requirements: hardness, color, thickness, sizes, different structure composition

Sample request

The information and statements herein are believed to be reliable but are not to be construed as a warranty or representation for which we assume legal responsibility. Users should undertake sufficient verification and testing to determine the suitability for their own particular purpose of any information or products referred to herein.